MR18R162GAF0-CK8 SCHEDA,CIRCUITO,LA FUNZIONE

MR18R162GAF0-CK8 Datasheet PDF

Costruttore	Imballaggio	Descrizione	PDF	Temperatura
Samsung semiconductor		(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V		Min.°C \| Max°C

Samsung semiconductor MR18R162GAF0
(MR18R1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die
Samsung semiconductor MR18R162GAF0-CK8
(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor MR18R162GAF0-CM8
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
Samsung semiconductor MR18R162GAF0-CN9
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
Samsung semiconductor MR18R162GAF0-CT9
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V